HSC2011/Documentation: Unterschied zwischen den Versionen

Version vom 22. April 2011, 03:37 Uhr


2011-03-23: Working on a very early prototype -- Part 1	2011-03-24: Working on a very early prototype -- Part 2
Day 3 of the hackerspace challenge + zwax and his amaaaazing pancakeinator	2011-03-29 (Day 4): Demo Firmware is finished
2011-03-31: testing the RF protocol implementation	2011-04-08: prototyping PCBs manufactured and soldered, final hardware design draft built on breadboard
2011-04-16: case mockup	2011-04-20: another take from 3d printing the case


first prototype shield, handwired	soldering manufactured prototype shield
comparison of prototypes	finished shiny prototyping board.
now we have 5 devices to play	Sebi is building a clay model of the case
3d printed case mockup: the inner surface of the lid	And the cover's outside

@@ Zeile 35: / Zeile 35: @@
 | valign="top"| {{#ev:youtube|KzopJVssksE}}
--04-20: another take frem 3d printing the case
+-04-20: another take from 3d printing the case
 |}
@@ Zeile 56: / Zeile 56: @@
 | valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|left|now we have '''5''' devices to play]]
 | valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|left|Sebi is building a clay model of the case]]
+|-
+| valign="top"|[[Datei:HSC2011-case-cover-1-temp.jpg|thumb|400px|left|3d printed case mockup: the inner surface of the lid]]
+| valign="top"|[[Datei:HSC2011-case-cover-2-temp.jpg|thumb|400px|left|And the cover's outside]]
 |}