HSC2011/Documentation: Unterschied zwischen den Versionen

Version vom 27. April 2011, 14:45 Uhr


2011-03-23: Working on a very early prototype -- Part 1	2011-03-24: Working on a very early prototype -- Part 2
Day 3 of the hackerspace challenge + zwax and his amaaaazing pancakeinator	2011-03-29 (Day 4): Demo Firmware is finished
2011-03-31: testing the RF protocol implementation	2011-04-08: prototyping PCBs manufactured and soldered, final hardware design draft built on breadboard
2011-04-16: case mockup	2011-04-20: another take from 3d printing the case


first prototype shield, handwired	soldering manufactured prototype shield
comparison of prototypes	finished shiny prototyping board.
now we have 5 devices to play	Sebi is building a clay model of the case
3d printed case mockup	case closeup

@@ Zeile 58: / Zeile 58: @@
 |-
-| valign="top"|[[Datei:HSC2011-case-cover-1-temp.jpg|thumb|400px|left|3d printed case mockup: the inner surface of the lid]]
+| valign="top"|[[Datei:HSC2011-case-assy.jpg|thumb|400px|left|3d printed case mockup]]
-| valign="top"|[[Datei:HSC2011-case-cover-2-temp.jpg|thumb|400px|left|And the cover's outside]]
+| valign="top"|[[Datei:HSC2011-case-battery-closeup.jpg|thumb|400px|left|case closeup]]
 |}