HSC2011/Documentation: Unterschied zwischen den Versionen
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− | | valign="top"|[[Bild:hsc2011_prototype_pcb2.jpg|thumb|400px|first prototype shield, handwired]] | + | | valign="top"|[[Bild:hsc2011_prototype_pcb2.jpg|thumb|400px|left|first prototype shield, handwired]] |
− | | valign="top"|[[Bild:hsc2011_prototype_pcb1.jpg|thumb|400px|soldering manufactured prototype shield]] | + | | valign="top"|[[Bild:hsc2011_prototype_pcb1.jpg|thumb|400px|left|soldering manufactured prototype shield]] |
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− | | valign="top"|[[Bild:hsc2011_prototype_pcb3.jpg|thumb|400px|comparison of prototypes]] | + | | valign="top"|[[Bild:hsc2011_prototype_pcb3.jpg|thumb|400px|left|comparison of prototypes]] |
− | | valign="top"|[[Bild:hsc2011_prototype_pcb4.jpg|thumb|400px|finished shiny prototyping board.]] | + | | valign="top"|[[Bild:hsc2011_prototype_pcb4.jpg|thumb|400px|left|finished shiny prototyping board.]] |
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− | | valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|now we have '''5''' devices to play]] | + | | valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|left|now we have '''5''' devices to play]] |
− | | valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|Sebi is building a clay model of the case]] | + | | valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|left|Sebi is building a clay model of the case]] |
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Version vom 16. April 2011, 08:53 Uhr
Videos (Alert The Internets)
2011-03-23: Working on a very early prototype -- Part 1 |
2011-03-24: Working on a very early prototype -- Part 2 |
Day 3 of the hackerspace challenge |
2011-03-29 (Day 4): Demo Firmware is finished
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2011-03-31: testing the RF protocol implementation |
2011-04-08: prototyping PCBs manufactured and soldered, |
2011-04-16: case mockup |
Pictures
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