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HSC2011/Documentation: Unterschied zwischen den Versionen

cover pics
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2011-04-20: another take frem 3d printing the case
2011-04-20: another take from 3d printing the case
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| valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|left|now we have '''5''' devices to play]]
| valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|left|now we have '''5''' devices to play]]
| valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|left|Sebi is building a clay model of the case]]
| valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|left|Sebi is building a clay model of the case]]
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| valign="top"|[[Datei:HSC2011-case-cover-1-temp.jpg|thumb|400px|left|3d printed case mockup: the inner surface of the lid]]
| valign="top"|[[Datei:HSC2011-case-cover-2-temp.jpg|thumb|400px|left|And the cover's outside]]


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