HSC2011/Documentation: Unterschied zwischen den Versionen

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K (Videos (Alert The Internets): moar 3d printing)
(cover pics)
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2011-04-20: another take frem 3d printing the case
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2011-04-20: another take from 3d printing the case
 
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| valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|left|now we have '''5''' devices to play]]
 
| valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|left|now we have '''5''' devices to play]]
 
| valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|left|Sebi is building a clay model of the case]]
 
| valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|left|Sebi is building a clay model of the case]]
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| valign="top"|[[Datei:HSC2011-case-cover-1-temp.jpg|thumb|400px|left|3d printed case mockup: the inner surface of the lid]]
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| valign="top"|[[Datei:HSC2011-case-cover-2-temp.jpg|thumb|400px|left|And the cover's outside]]
  
 
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Version vom 22. April 2011, 04:37 Uhr

Videos (Alert The Internets)

2011-03-23: Working on a very early prototype -- Part 1

2011-03-24: Working on a very early prototype -- Part 2

Day 3 of the hackerspace challenge
+ zwax and his amaaaazing pancakeinator

2011-03-29 (Day 4): Demo Firmware is finished


2011-03-31: testing the RF protocol implementation

2011-04-08: prototyping PCBs manufactured and soldered,
final hardware design draft built on breadboard

2011-04-16: case mockup

2011-04-20: another take from 3d printing the case

Pictures

first prototype shield, handwired
soldering manufactured prototype shield


comparison of prototypes
finished shiny prototyping board.
now we have 5 devices to play
Sebi is building a clay model of the case
3d printed case mockup: the inner surface of the lid
And the cover's outside