HSC2011/Documentation: Unterschied zwischen den Versionen
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Zur Navigation springenZur Suche springenChrysn (Diskussion | Beiträge) (added pic of clay case) |
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2011-03-29 (Day 4): Demo Firmware is finished | 2011-03-29 (Day 4): Demo Firmware is finished | ||
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− | 2011-04-08: prototyping PCBs manufactured and soldered, final hardware design draft built on breadboard | + | 2011-04-08: prototyping PCBs manufactured and soldered,<br/> |
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| valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|now we have '''5''' devices to play]] | | valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|now we have '''5''' devices to play]] | ||
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| valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|Sebi is building a clay model of the case]] | | valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|Sebi is building a clay model of the case]] | ||
Version vom 14. April 2011, 06:07 Uhr
VIDS (Alert The Internets)
2011-03-23: Working on a very early prototype -- Part 1 |
2011-03-24: Working on a very early prototype -- Part 2 |
Day 3 of the hackerspace challenge |
2011-03-29 (Day 4): Demo Firmware is finished
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2011-03-31: testing the RF protocol implementation |
2011-04-08: prototyping PCBs manufactured and soldered,
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PICS
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