HSC2011/Documentation: Unterschied zwischen den Versionen
Chrysn (Diskussion | Beiträge) added pic of clay case |
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==Alert The Internets== | ==VIDS (Alert The Internets)== | ||
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2011-03-29 (Day 4): Demo Firmware is finished | 2011-03-29 (Day 4): Demo Firmware is finished | ||
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2011-04-08: prototyping PCBs manufactured and soldered, final hardware design draft built on breadboard | 2011-04-08: prototyping PCBs manufactured and soldered,<br/> | ||
final hardware design draft built on breadboard | |||
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==PICS== | |||
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| valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|now we have '''5''' devices to play]] | | valign="top"|[[Bild:hsc2011_prototype_pcb5.jpg|thumb|400px|now we have '''5''' devices to play]] | ||
| valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|Sebi is building a clay model of the case]] | | valign="top"|[[Bild:Hsc2011 clay 0221.JPG|thumb|400px|Sebi is building a clay model of the case]] | ||