HSC2011/Hardware: Unterschied zwischen den Versionen

Version vom 1. Mai 2011, 20:38 Uhr

Partname	Amount	Position on PCB	Bauteilsortiment	known bugs
LED 5mm BLUE	1	D1	-
LED 5mm GREEN	1	D2	G4
LED 5mm YELLOW	1	D3	-
LED 5mm RED	1	D4	H4
Pushbutton	4	SW1, SW2, SW3, SW4	E9
LF50CV	1	VREG1	G6
Piezo beeper	1	U3	S7
2x16 Pol, RM 2.00	1	U1	C5	needs 2x6 pin socket
RFM12B Radio module	1	U1	K8
28 PIN DIP Socket	1	IC4	D9
ATMEGA328P	1	IC4	-
10 uF Capacitor (elko)	1	C4	E0
22 pF Capacitor (ceramic)	2	C1, C2	A2
100 nF Capacitor (ceramic)	1	C3	C2	imprint unter loch
16 Mhz Crystal	1	CRYSTAL1	L0
9V battery clip	1	JP3	T3	imprint should say +/- not J3 ;)
FTDI connector	1	JP4	B6
Resistor 100 ohm	1	R10	N1	nicht bestücken! (R10)
Resistor 10K ohm	1	P9	P3	desc should be R9 not P9
Resistor 1K ohm	7	R5, R6, R7, R11, R12, R13	O2
Resistor 680 ohm	4	R1,R2,R3,R4	?	am plan noch als 1k eingezeichnet
Resistor 4K7 ohm	1	R8	-
RGB LED 5mm	1	D5	-
Switch MIYAMA MS 245	1	SW5	S9	connect over cable!

Nodes are supposed to be equipped with:

RF transceiver
4 buttons, labelled with digits, letters, colours (probably red / blue / green / yelow) and symbols (playstation style?)
a LED for each button in matching colour
an RGB LED
a buzzer
a 1-wire interface for authentication buttons (iButton)

For ease of development, they also get a serial interface ("FTDI cable" -- power supply + RX/TX + reset, also for flashing using a boot loader).

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 == Part list==
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